Description
Chip Quik TS391AX
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63/37 Tin Lead Thermally Stable Solder Paste (5cc/15g Syringe)
Shelf Life
- Refrigerated >12 months, unrefrigerated >12 months
Stencil Life
- >12 hours @ 20-50% RH 22-28°C (72-82°F)
- >4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
- Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
- Store at room temperature 20-25°C (68-77°F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25°C (68-77°F), therefore no warming time is required before use.
Transportation
- This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life.
Solder Paste Template | |
|---|---|
| Alloy Type | Sn63/Pb37 |
Product General Attributes | |
| HTS/Schedule B Number | 3810.10.0000 |
| ECCN Number | EAR99 |
| Country of Origin | United States |


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