Description

Kester 300303
- 30 Grams syringe
- Compatible with Lead-Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
- Reflow-able with peak temperatures up to 270 °C
- Reflow-able in air and nitrogen
TSF-6592LV Lead-free No-clean Tacky Flux, 30 Grams Syringe
Kester 300303 TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip-chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high-speed printing applications.
General Attributes | |
|---|---|
| Shipping Weight | 0.08 LBS |
Product General Attributes | |
| Safety Approval | RoHS |


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