Ersa i-CON VARIO 2 AC MK2 – Multichannel Soldering and Desoldering Station (115V)

• Uses type 472 hot air nozzles and type 462 soldering tips
• Includes i-CON VARIO 2 MK2 station with hot air pump (1ICV2035A00A67), i-TOOL AIR S hot air iron (0470ERJ), hot air nozzle (0472ER), CHIP TOOL VARIO desoldering tweezers (0460MDJ), desoldering tips (0462MDLF007), holder for i-TOOL AIR S (0A55), holder for CHIP TOOL VARIO (0A54)
• Soldering and desoldering station to operate one i-TOOL AIR S and another soldering tool at the same time
• Intelligent power management for dynamic power distribution
• Extremely silent blow air supply for i-TOOL AIR S

The multichannel soldering and desoldering station i-CON VARIO MK2 provides the professional user with two soldering tools that can be used simultaneously.

Equipped with the easy-to-operate i-OP facility and its clearly arranged display. In addition, the soldering stations have interfaces for the Ersa solder fume extraction units or infrared heating plates, as well as a USB port. Via a micro-SD memory card, the stations can be quickly and safely configured. Therefore, they are optimally prepared for all applications in professional electronics manufacturing – including ESD-protected zones.

The high-performance bushing A2 can be used to operate either the i-TOOL AIR S (200 W) or the i-TOOL HP (250 W). The station without the pumps is for users that want to use exclusively the i-TOOL HP and the i-TOOL.

Station Capabilities 

i-TOOL AIR S uses type 472 hot air nozzles 

CHIP TOOL VARIO uses type 462 soldering tips

See handpiece and tool compatibility here

See tip guide here

The i-CON VARIO 2 is perfectly suited for all SMT and PTH soldering applications in electronic production, rework, and touch-up as well as in R&D. Especially suited for SMT soldering and desoldering are the hot air tool i-TOOL AIR S and the desoldering tweezers CHIP TOOL VARIO.

The range of applications includes the smallest SMD chips (0201), all kinds of standard SMD components up to high pin count components like PLCC 84, and high mass solder joints in PTH technology including their desoldering with a solder succing device.