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Kester 302703 – Tacky Soldering Flux, No-Clean, TSF-6592HF, 30g Syringe
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Original price was: $1,425.00.$1,228.50Current price is: $1,228.50.
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Estimated delivery:4 days
TSF-6592HF 30g SYR No Clean Flux Type 30g Syringe-Note:Price is for 25 Units
- Compatible with lead-free alloys such as SnAg, SnCu, SnAgCu, SnAgBi
- Reflowable with peak temperatures up to 270°C
- Reflowable in air and nitrogen
- Low voiding
- Bright shiny soldered joints with clear residues
- Aggressive flux on various substrates such as OSP-Cu, immersion finishes and ENIG
- Clear non-tacky residues
- Classified as ROL0 per J-STD-004A
- High tack to minimize skewing of components
- Stencil life of 8+ hours (process dependent)
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Description
Kester Tacky Soldering Flux, No-Clean, TSF-6592HF, 30g Syringe
Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.Â
Standard Applications
TSF-6592HF is designed for stencil/screen printing, rotating drum, slide fluxers and/or syringe
applications. This flux is great for rework applications on all PCB packages of various electronic
devices. TSF-6592HF can be used in BGA/PGA sphere/pin attachment vehicle or for repair and
reballing/repinning. This flux works on flip chip, chip scale package and flip chip bumping sites
assemblies as a soldering paste flux.
Product General Attributes | |
|---|---|
| Safety Approval | RoHS |
| Shipping Weight | 1.00 LBS |
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Kester 302703 – Tacky So... Original price was: $1,425.00.$1,228.50Current price is: $1,228.50.
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Contact Us Now:
📧 sales@nestesinstruments.com
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Let us assist you in finding the perfect solution!
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