Description
Kester 70-0102-0510
- Alloy: Sn63Pb37
- Lead Type: Leaded
- Package-Type: Jar
- Volume: 500g
- Stable wetting behavior over a wide range of profiles
EP256 Solder Paste, No-Clean, Leaded, 500g Jar
EP256 Solder Paste is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning
RoHS Compliance
Kester does not determine any applicable Restriction of Hazardous Substances (RoHS) exemptions for our lead-containing products at the user level.
Kester EP256 Series Comparison Table
| Model Number | Alloy | Powder Size | Type | Halogen Content | Lead Content | Description | Process |
| 70-0102-0510 | Sn63Pb37 | 3 | No-Clean | Contains Halogen | Leaded | EP256 Sn63Pb37 T3 90% 500g JAR | Screen/Stencil Printing |
| 70-0102-0511 | Sn63Pb37 | 3 | No-Clean | Contains Halogen | Leaded | EP256 Sn63Pb37 T3 90% 600g CRT | Screen/Stencil Printing |
Solder Paste Template | |
|---|---|
| Alloy Type | Sn63/Pb37 |
Product General Attributes | |
| Safety Approval | RoHS |
| Product Weight | 1.10231 LBS |
| Shipping Weight | 1.18 LBS |
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