Description

MG Chemicals 4860P-35G
- Flux meets J-STD-004B
- Non-corrosive
- Non-conductive residue
- Halide free
63/37 Tin Lead Solder Paste, 35 Grams, No Clean
The 4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder blended with a no clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, non-conductive, non-corrosive, and highly insulated. No clean means that residues are not harmful to assemblies.
Applications & Usages
The solder paste is designed to accommodate high-speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils down to 0.3 mm.
Solder Paste Template | |
|---|---|
| Alloy Type | Sn63/Pb37 |
Product General Attributes | |
| Product Height | 0.95 IN |
| Product Length | 7.90 IN |
| Product Width | 1.95 IN |


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