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MG Chemicals 4865-454G – 63/37 Tin Lead Solder,1.0 Pound Spool,No Clean

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63/37 Tin Lead Solder,1.0 Pound Spool, No Clean

  • Eutectic alloy (liquidus = solidus temperature
  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Spreads like rosin-activated flux
  • Virtually non-splattering
  • Non-corrosive residue
  • Halide free
  • For a complete list of alloys and part numbers, please see the Documents section on this page, for the MG Chemicals Solder Wire – Part Number Guide
SKU: MG Chemicals 4865-454G EAN: 779008486542 Tags: , Categories:
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Description

MG Chemicals 4865-454G

  • No clean flux
  • Non-conductive residue
  • Eutectic alloy
  • Halide free
  • For a complete list of alloys and part numbers, please see the Documents section on this page, for the MG Chemicals Solder Wire – Part Number Guide

63/37 Tin Lead Solder,1.0 Pound Spool, No Clean

The MG Chemicals 4865 Sn63/Pb37 No Clean Solder Wire is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio, which is complemented with a no-clean, synthetically refined, splatter-proof, resin flux core. The solder wires meet J-STD-004B, ASTM B 32, and exceed J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

The leaded solders achieve a consistent solder and flux percentage through a state-of-the-art, extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

Solder Wire Template

Alloy TypeSn63/Pb37

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