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MG Chemicals 4900P-25G – SAC305 No Clean Solder Paste (25 Grams)
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$30.50
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Lead Free Solder Paste, SAC305, No Clean (Keep Refrigerated)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent print characteristics
- Long stencil and tack life to accommodate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmosphere
- Medium soft, non-cracking residues
- Dobb-Frank (DRC conflict free)
- REACH compliant
- RoHS compliant
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Description
MG Chemicals 4900P-25G
- Excellent wettability
- Suitable for air or nitrogen atmosphere
- Medium soft, non-cracking residues
- Dobb-Frank (DRC conflict free)
SAC305 No Clean Solder Paste (25 Grams)
The 4900P No Clean Solder Paste is made from a blend of high-purity, non-recycled tin, silver, and copper metal powder mixed with a no clean flux. This lead-free and halogen-free solder paste is designed for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
Applications & Usages
The solder paste is designed to accommodate high-speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils down to 0.3 mm.
Solder Paste Template | |
|---|---|
| Alloy Type | SAC305 |
Product General Attributes | |
| Product Height | 0.95 IN |
| Product Length | 7.90 IN |
| Product Width | 2.00 IN |
| HTS/Schedule B Number | 9801.00.1098 |
| ECCN Number | EAR99 |
| Country of Origin | United States |
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Manuals/Guides
Spec SheetsMSDS Sheet
| Dimensions | 7.9 × 2 × 0.95 in |
|---|
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MG Chemicals 4900P-25G –... $30.50
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