Pace TF 1800 – BGA and SMD Rework System (Part Number 8007-0574)

Pace TF 1800 – BGA and SMD Rework System (Part Number 8007-0574)

BGA / SMD rework system

• Induction – convection heating technology
• Reaches target temperature in seconds
• Height adjustable pre-heater
• Ultra-precise placement capability

Conventional resistance coil heating technology has been successfully used in convective rework station for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 1800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

Top-Side Heater: Fast Heat Up – Rapid Cool Down

PACE’s Inductive-Convection Heater easily outperforms competitive heaters which utilize standard forced air convection technology, achieving target temperature instantaneously, about 4x faster than competitive heaters. Unlike conventional heaters, the TF 1800 immediately drops to temperatures well below solder melt when the heater is de-energized.

How Inductive-Convection Heating Works

The TF 1800’s Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.

1. The air is first pre-heated in the outer heater chamber as it moves in a cyclonic fashion around the induction coil before it enters the inner chamber.
2. After entering the inner chamber, the pre-heated air is then heated to target temperature through a highly efficient heat transfer process in an energized induction field.
3. During active cooling, the induction coil is de-energized and the TF 1800 delivers fast, controlled, active cooling of the component and PCB directly through the nozzle, eliminating the risk of excessive intermetallic growth and yielding the highest quality solder joints.