PACE TF2800 – BGA and SMD Rework System (8007-0582)

PACE TF2800 – BGA and SMD Rework System (8007-0582)

The TF 2800’s Inductive-Convection Heating Technology delivers all the power you need to tackle the most challenging high thermal mass PCBs available today. Yet, its highly-efficient design does it with just a fraction of the power required by yesterday’s conventional heating technology.

1. Single-Axis Operation
2. Win 10 Micro PC with 24″ LCD Monitor
3. Operator-Friendly Software Suite
4. Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging
5. Auxiliary Cooling Fan
6. Precision 24″x24″ PCB Holder

7. Board Support Beam
8. Adjustable Height Bottom-Side IR Preheater
9. Thermocouple Inputs (4)
10. Active Cooling Through Nozzle Provides Rapid Solder Cooldown
11. Revolutionary Inductive-Convection Heater
12. Ultra-Precise 28μm Placement Accuracy

Rework Extra Large Boards with High Precision

• Incorporates unique patented heater technology and designed for board handling capability up to 24×24

Powerful, Height Adjustable Bottom Heater

• An array of 7 IR emitters capable of preheating large, high mass assemblies, with height adjustment up to 1.5″ (38mm)

High Definition Alignment System with Quad-Field Imaging

• Allows all four corners of the component to be viewed under HD magnification. Ideal for oversized BGAs or fine-pitch QFPs.

High-Definition Vision Overlay System

Height Adjustable Bottom Heater

Automated Alignment System with Quad-Field Imaging

How Inductive-Convection Heating Works

The TF 2800’s patented Inductive-Convection Heating Technology provides ultimate thermal performance by its ability to instantly heat up and cool down the temperature of the air it delivers to the work.