Chip Quik TS391LT – Sn42/Bi57.6/Ag0.4 Thermally Stable Solder Paste (5cc/15g Syringe)

• Revolutionary Formula: No Refrigeration Required!
• Alloy: Sn42/Bi57.6/Ag0.4
• Flux Type: Synthetic No-Clean
• Flux Classification: ROL0
• Metal Content: 87% metal by weight

Shelf Life

• Refrigerated >12 months, unrefrigerated >12 months

Stencil Life

• >12 hours @ 20-50% RH 22-28°C (72-82°F)
• >4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

• Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

• Store at room temperature 20-25°C (68-77°F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25°C (68-77°F), therefore no warming time is required before use.

Transportation

• This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground or air will not impact this product’s stated shelf life.