Description

Kester 70-0403-0810
- Alloy: Sn96.5Ag3.0Cu0.5
- Package-Type: Jar
- Volume: 500g
- Flux Type: Water-Soluble
- Low-voiding underneath area array components
EM828 Solder Paste, Water Soluble, Lead-Free, 500g Jar
Kester EM828 Solder Paste is a lead-free, water-soluble solder paste formulated specifically to reduce the voiding behavior that is common with lead-free solder paste products. EM828 represents a breakthrough in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior, and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time, or throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes to simplify your transition to lead-free processes.
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS), 2002/95/EC Article 4 for the stated banned substances.
Kester EM828 Series Comparison Table
| Model Number | Alloy | Powder Size | Type | Halogen Content | Lead Content | Description | Process |
| 70-0403-0810 | Sn96.5Ag3.0Cu0.5 | 3 | Water-Soluble | Contains Halogen | Lead-Free | EM828 Sn96.5Ag3.0Cu0.5 T3 89.5% 500g JAR | Screen/Stencil Printing |
| 70-0403-0823 | Sn96.5Ag3Cu.5 (SAC305) | 3 | Water-Soluble | Contains Halogen | Lead-Free | EM828 Sn96.5Ag3Cu.5 (SAC305) T3 89.5% 500g CRT | Screen/Stencil Printing |
Solder Paste Template | |
|---|---|
| Alloy Type | Sn96.5/Ag3.0/Cu0.5 |
Product General Attributes | |
| Safety Approval | RoHS |
| Product Weight | 1.10231 LBS |


Reviews
There are no reviews yet.